In recent years, there have been frequent occurrences of counterfeit components. To ensure the quality of components, X-ZEN purchases quality-assured components directly from end manufacturers or their authorised agents to give customers peace of mind.

X-ZEN has strict product traceability and anti-counterfeiting control measures to ensure that customers are provided with original supply and quality-assured components.

The Four Advantages

Professional Engineers
Professional testing equipment
Factory Direct
Global Distribution

Eight tests

Testing laboratory

Testing items

Ultrasonic scanning failure analysis

Ultrasonic scanning failure analysis provides non-destructive detection of internal material defects such as delamination, voids and cracks, providing visual evidence of the cause of failure and ensuring product quality and reliability.

Static parameter test

Static parameter testing is designed to verify the correctness and consistency of software or system parameters when not running.

High temperature aging test

Evaluates the durability and stability of products in prolonged high-temperature environments to predict their service life and ensure their reliability under extreme conditions.

Solderability Test

Evaluate the tinning capability of chip pins to ensure solder quality and product reliability.

Function programming test

Verify that the chip functions meet the design requirements and ensure reliable performance.

Impedance analysis test

The purpose of impedance analysis testing is to evaluate the response characteristics of a circuit or component to alternating current and to ensure stable circuit performance.

Uncapping Inspection

The purpose of open-cap inspection is to expose the devices inside the package so that the chip surface can be observed for electrical probing and topographical analysis.